Frequently Asked Environmental Questions (FAQ)
What is RoHS?
RoHS stands for Restriction of use of Hazardous Substances. RoHS is a directive issued January 27, 2003 by the European Commission (EC).
The RoHS directive requires that six hazardous substances are removed from all electrical and electronic equipment. The substances may be present incidentally at certain levels as long as they are declared. The six substances are Cadmium (Cd), hexavalent Chromium (CR VI), Lead (Pb), Mercury (Hg), polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE).
Is a leadfree product RoHS compliant?
Yes, Melexis' ICs which are Lead-Free are RoHS compliant and meet the regulatory thresholds for cadmium, hexavalent chromium, lead, mercury, polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs).
What is the material that is used in the leadfree plating?
Melexis is using Matte Pure Tin (pure Sn) to replace the tin lead (SnPb) plating. Matte Tin is being adopted by the majority of electronic component manufacturers. It is proven to be compatible with the different available Lead free solder processes and is forward and backward compatible.
How will lead free and/or green part be distinguished from earlier lead bearing versions?
Melexis is maintaining traceability through its lot and date code information branded on the IC’s. No special or specific marking will be added as all products are already marked by date code and the conversion process is occurring at a given moment in time. Packing and shipping containers will be clearly marked as below:Lead free/RoHS compliant products
Green products
What is the storage specification for the new plating?
Storage conditions are mentioned on the stickers and should follow the J-STD 33 standard (related to the Moisture Sensitivity level)
http://www.jedec.org/download/search/jstd033a.pdf
What is the solder profile needed for the new plating?
Melexis advises that reflow profiles should conform to the JEDEC standard J-STD 20. The Moisture sensitivity level and peak temperature are mentioned on the dry pack stickers.
You can also see the document: Lead free soldering, thru hole, hand solder, surface mount and welding recommendations are detailed.
 Download Standard Soldering Information for Melexis Customers (PDF)
What is the moisture sensitivity level?
Each package family will have a moisture sensitivity level (MSL) defined after the reliability tests. The information will be clearly visible on the packing material.
Do you have information about “tin whiskers”?
Whisker is a spontaneous columnar or cylindrical filament emanating from the surface of a plating finish.
To mitigate whisker growth Melexis has implemented a post-plate annealing of 1 hour at 150°C within 24 hours of plating
Is a Pb containing component compatible with a leadfree process? Is a leadfree component compatible with SnPb process?
See compatibility table below:
Lead finish |
Reflow Process and Peak Temperature Range |
Tin/Lead Process
(220°C - 235°C) |
Lead-Free Process
(240°C - 260°C) |
Tin/Lead (SnPb) |
OK |
OK if device qualified for
260°C (forward compatible) |
Lead-free (matte Sn) |
OK (backward compatible) |
OK |
|