#

Test

Abr.

Refer to
MIL-STD 883
JEDEC-STD-22

Conditions
Requirements

Duration

Sample Size per Lot 1)

Numberof Lots

Accepton
# fails

Comment

1

Preconditioning 3)

subsequent

PC

JA113

J-STD-020

acc. to MRT- level

see Annex 5

-

77

1

0

RT

--

Temperature

cycling 5)

post test

Bond pull test

TC

BPS

M1010

JA104

AEC-Q100

-65°C / 150°C

or

-50°C / 150°C

500 cycl.

1000 cycl.

5

1

0

RT,HT

2

Preconditioning 3)

subsequent

PC

JA113

J-STD-020

acc. to MRT- level

see Annex 5

- -

77

1

0

RT

--

Temperature Humidity Bias 4)

post test

Internal Inspection

THB

JA101

85°C / 85% R.H.4.)
alternating VDDmax
at all pins

1000 h

5

1

0

RT,HT

3

Preconditioning 3)

subsequent

PC

JA113

J-STD-020

acc. to MRT- level

see Annex 5

- -

77

1

0

RT

-

Autoclave

post test

Internal Inspection

AC

JA102

121°C / 100% RH
storage

240 h 2)

5

1

0

RT

4

High Temperature

Bake

HTB

M1008

JA103

175°C, storage

500 h

77

1

0

RT,HT

5

Resistance to solvents

-

M2015

Isopropanol
Turpentine solution
DI water

-

12

1

0

not required for

laser marked devices

6

Resistance to solder heat 6)

CECC 00802

bake : 24h 150°C

humidity soak

(acc. to MRT-level)

260°C; 10 sec
215°C; 40 sec

-

15

10

5

1

0

RT

7

Solderability

SD

M2003

JB102

8 h water vapour
245°C; 5s

-

15

1

0

-

8

Internal Inspection

Bond pull strength

Bond shear

BPS

BS

M2011

AEC-Q100-001

-

-

5

1

0

30 bonds from a min. of 5 devices